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Headphone Lower Housing (1*2)
No.23306 &23307
| Mold base P/N: DAI2740 808090 | |||
| Mold size | Length | Slide | |
| 270 | 4 | ||
| Width | Lifter | ||
| 490 | 10 | ||
| Height | Double-shot molding | ||
| 406 | |||

| Mold weight | IMM Tonnage | Type | Standard | ||||
| 900kg | 180T | Three-plates mold | LKM |

| Gate | Tool life | Surface finish | Steel of cavity & core | ||||
| Pin point gate | 500K shots | A surface polished to SPI-B1 | Harden (1*2/S136) |

| Part material | Part weight | Part size | Injection/runner type | ||||
| PC/PC+ABS | 1.6g | 55.01*21.4*11.5mm | Hot runner |

Display diagram



